The choice of deposition technique is dependent on the application and specific material requirements.
The thermal evaporation system is a simple, cost-effective approach to deposit a variety of materials. A high temperature option allows the deposition of lower melting metals commonly employed for electrical contact applications. A low temperature source is also offered for producing thin organic films.
The sputtering option allows the deposition of higher melting point metals which cannot be achieved by thermal techniques. High energy argon ions generated within a plasma strike the target material which is sputtered from the surface and deposited on the test substrate.
The sputter technique provides a high degree of film uniformity. Additionally, higher density coatings are achieved compared to the thermal approach. It is widely employed for optical devices.
E-beam evaporation is another thermal technique. Energetic electrons impinge on the source material, resulting in the evaporation of high melting point metals not possible with the purely thermal technique combined with increased deposition as compared with the thermal technique.
The choice or choices of deposition sources can be selected to meet individual requirements.
For samples that are air sensitive, the addition of a glovebox is possible for the 250 version. Larger chambers are available, namely 350 and 450, to accommodate increased diameter substrates.
For accurate and repeatable thin film coatings, Leybold also provides film thickness monitoring using quartz crystal technology. These can monitor a single film type or with the addition of multiple heads measurement of sequential film depositions. It is also possible to automatically deposit films with choice of controller to the desired thickness - Ideal for prototype applications